PROFESSIONAL BACKGROUND

Applied Technology and Science Gilbertsville, Pennsylvania��

Principal Consultant:

Operations Facilitation

� For an Instrument manufacturer: Provided short term additional resources for Strategic Sourcing group to improve procedures, establish KPI Metrics, prepare for customer audit, establish plans for supply of critical components and raw materials and track first production parts procurement.

� For Gemalto: To resolve yield and scrap problems, showed them how to prepare tolerance budget and guided its application to determine major sources of process yield loss and scrap.

� For Numonics: To resolve a scrap problem, provided both an outside perspective regarding causes and statistical support for the analysis of the data collected. Alos researched equipment for a new process, evaluated vendors and established the operating parameters for equipment from the chosen vendor.

� For Tyco-Scott Health and Safety: Relocated critical production line to new facility. Reviewed Bills-of-Materials for several products to improve accuracy and structure. Provided analysis of labor content for products.

� For Tyco Scott Instruments: Recommended process and equipment changes to improve new product manufacturability, including revisions to process documentation, establishment of cause-effect relationships, improvements to process controls. Achieved improved yields.

� For DCSI, a PPLsub-contractor : Provided project management for an unplanned electric meter replacement program including scheduling crews, arranging for staging facilities and customer support.

� Jeffries Electric, Inc.:Prepared estimates, provided AutoCAD support and ran field jobs.

Agere Systems (subsidiary of Lucent Corporation), Breinigsville, Pennsylvania��

Development Program Manager: Optoelectronics Product Platform Development

Cost Reduction

� Led Development and Manufacturing Engineering Team to achieve 15% improvement in Optical Sub-Assembly customer returns through the implementation of protection scheme for product shipments.

� Lead product team in a 6 month march towards 95% yield goal in areas of diebond, and optical coupling for a Metro Access Transceiver product.

Visteon Corporation (formerly Ford Motor Company), Lansdale, Pennsylvania

Concurrent Engineering Leader: Automotive Electronics Manufacturing Technology

Development

� Drove Product Design and Vendors to achieve high yielding, cost competitive solutions to package ceramic exhaust gas sensor.

� Contributed in Manufacturing Concurrent Engineering Team to develop manufacturing processes for Thin Metal Welding, Abrasive Paste Application and tight Tolerance assembly.

Leadership

� Led Manufacturing Concurrent Engineering Team to bring to production within 12 months a new Antilock Brake electronics module including the design and delivery of a $4M automated line.

� Organized and coached team to achieve breakthrough timing, identified and solved technical risks within context of multisite organizations and multiple vendors.

� Resolved problems found during ramp-up and implemented rapid improvements in response to external customer concerns.

IBM Corporation, Mid‑Hudson Valley, New York

Manufacturing Engineering: PCB and Flip Chip Assembly

Complex Program Management

� Qualified for production a new generation of multi layer boards for IBM mainframe computers.

� Achieved objectives with 30% improvement in lead-time through concurrent engineering.

� Provided processes, equipment and data systems specifications to production facilities worldwide.

Technical Innovation

� Initiated and led joint Development/Manufacturing transfer of advanced flip chip rework tooling and process to plant for multi-chip module to establish manufacturing capability.

� Lead Task Force to eliminate cause of solder bump opens on ceramic Multi-chip module.

� Initiated programs implemented to use of miniature coax wiring to solve program stopping signal noise problems, to implement multi‑image panels to achieve target costs.

� Initiated and drove multi-organization effort to eliminate a PCB Bake operation to save $250K annually.

Quality Leadership

� Initiated first Six Sigma Program in IBM to achieve break through yield improvements for PWB product line. Established strategy, negotiated participation and advised technically.

� Achieved 50 to 90% defect reductions through Engineering/Production teams using problem solving, Design of Experiments and SPC.

� Co-chaired corporate study of Process Control at IBM, resulting in the formation of corporate Competency Center.

Engineering Management: Process and Equipment Development

� Initiated review of strategic equipment direction for Flip Chip rework, identified fundamental problems and established new direction consistent with program schedule.

� Implemented $7,000,000 equipment build project including schedule, budgets and supporting commitments. Delivered within program schedule and within 10% of budget.

� Organized department into teams providing rapid response for Production Line Support on 3-shift basis.