"Facing Manufacturing Challenges"
THE BENT,
Spring 2009
(A publication of Tau Beta Pi, The Engineering Honor Society)
"Viewpoint on Manufacturing" monthly column
Route 422 Business Advisor,
2009
(A monthly business news magazine)
"KeyNotes" monthly column
IMAPS Keystone Chapter Newsletter,
1995 - 2007
(A synopsis of technical advances in packaging technology)
Using Modeling and Material Characterization for the Rapid Development of an Adhesive Bonding Process
ISHM 97 International Symposium, 1997.
Rapid Development of an Adhesive Bonding Process
11th Conference with Industry on Strategic Technologies for Global Manufacturing
Lehigh University, 1997.
Interaction of Staffing & Process
TR 00.3535, IBM Internal, 1989.
Assembly Bake Reduction For TCM Boards Using Dielectric Loss Measurements
TR 00.3485, IBM Internal, 1987.
Effects of the Angle of Pull on Wire Bond Failures
TR 00.3352, IBM Internal, 1985.
Auto Wire Bonding of Low Solder
TR 00.3252, IBM Internal, 1984.
Considerations in Shadow Casting with X‑Rays
Annual Meeting, American Electro‑Chemical Society, 1972.
A Feasibility Study on X‑Ray Proximity Printing
TR 22.1390, IBM Internal, 1971.
Proximity Printing: Predicting the Photoresist Image Profile in AZ‑1350H Using the Photoresist Response Curve
TR 22.1161, IBM Internal, 1970.
Implications of Diffraction in Non‑Contact Printing
TR 22.0778, IBM Internal, 1969.
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